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| STTH3002 Ultrafast recovery diode Main product characteristics IF(AV) VRRM Tj (max) VF (typ) trr (typ) 30 A 200 V 175 C 0.77 V 22 ns A K A K DO-247 STTH3002W A K DOP3I STTH3002PI Features and benefits Very low conduction losses Negligible switching losses Low forward and reverse recovery time High junction temperature Description The STTH3002 uses ST's new 200 V planar Pt doping technology, and is specially suited for switching mode base drive and transistor circuits. Packaged in DO-247, DOP3I, and DPAK, this device is intended for use in low voltage, high frequency inverters, free wheeling and polarity protection. K A NC D2PAK STTH3002G Order codes Part Number STTH3002W STTH3002PI STTH3002G STTH3002G-TR Marking STTH3002 STTH3002 STTH3002 STTH3002 May 2006 Rev 1 www.st.com 1/10 Characteristics STTH3002 1 Table 1. Symbol VRRM IF(RMS) Characteristics Absolute ratings (limiting values at Tj = 25 C, unless otherwise specified) Parameter Repetitive peak reverse voltage RMS forward current DO-247 Tc = 135 C IF(AV) Average forward current, = 0.5 DOP3I Tc = 115 C D2 IFSM Tstg Tj Surge non repetitive forward current Storage temperature range Maximum operating junction temperature PAK Tc = 135 C 300 -65 to + 175 175 A C C 30 A Value 200 50 Unit V A tp = 10 ms Sinusoidal Table 2. Symbol Thermal parameters Parameter DO-247 Value 1.2 1.8 1.2 C/W Unit Rth(j-c) Junction to case DOP3I D 2PAK Table 3. Symbol IR(1) Static electrical characteristics Parameter Reverse leakage current Test conditions Tj = 25 C Tj = 150 C Tj = 125 C VR = VRRM IF = 25 A IF = 30 A Min. Typ Max. 20 A 20 0.77 200 0.85 1.05 0.8 0.88 V Unit VF (2) Forward voltage drop Tj = 25 C Tj = 150 C 1. Pulse test: tp = 5 ms, < 2 % 2. Pulse test: tp = 380 s, < 2 % To evaluate the conduction losses use the following equation: P = 0.67 x IF(AV) + 0.007 IF2(RMS) 2/10 STTH3002 Table 4. Symbol Characteristics Dynamic characteristics Parameter Test conditions IF = 1 A, dIF/dt = -200 A/s, VR = 30 V, Tj = 25 C IF = 1 A, dIF/dt = -50 A/s, VR = 30 V, Tj = 25 C Min. Typ 22 40 7.6 140 2.5 Max. 27 ns 50 9.5 A ns V Unit trr Reverse recovery time IRM tfr VFP Reverse recovery current Forward recovery time Forward recovery voltage IF = 30 A, dIF/dt = 200 A/s, VR = 160 V, Tj = 125 C IF = 30 A, dIF/dt = 200 A/s VFR = 1.1 x VFmax, Tj = 25 C IF = 30 A, dIF/dt = 200 A/s, VFR = 1.1 x VFmax, Tj = 25 C Figure 1. IM(A) 200 Peak current versus duty cycle Figure 2. Forward voltage drop versus forward current (typical values) T 200 180 IFM(A) 180 160 140 120 P = 20 W IM d=tp/T tp 160 140 120 100 80 100 80 60 40 20 0 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 P = 10 W P=5W 60 40 20 Tj=150 C Tj=25 C VFM(V) 0.0 0.4 0.8 1.2 1.6 2.0 0 Figure 3. Forward voltage drop versus forward current (maximum values) Figure 4. Relative variation of thermal impedance, junction to case, versus pulse duration IFM(A) 200 180 160 140 120 100 80 60 40 20 0 0.0 0.4 0.8 1.2 1.6 2.0 Tj=150 C Tj=25 C Zth(j-c)/Rth(j-c) 1.0 Single pulse DPAK VFM(V) tp(s) 0.1 1.E-03 1.E-02 1.E-01 1.E+00 3/10 Characteristics STTH3002 Figure 5. Junction capacitance versus reverse voltage applied (typical values) Figure 6. Reverse recovery charges versus dIF/dt (typical values) C(pF) 1000 F=1 MHz Vosc=30 mVRMS Tj=25 C 350 300 250 200 150 100 50 VR(V) QRR(nC) IF = 30 A VR = 160 V Tj=125 C Tj=25 C dIF/dt(A/s) 0 1000 100 1 10 100 10 100 1000 Figure 7. Reverse recovery time versus dIF/dt (typical values) Figure 8. Peak reverse recovery current versus dIF/dt (typical values) 80 70 60 tRR(ns) 16 IF=30 A VR=160 V IRM(A) IF= 30 A VR= 160 V 14 12 Tj = 125 C 50 40 30 20 10 0 10 100 1000 Tj = 25 C 10 8 6 4 2 Tj=25 C Tj=125 C dIF/dt(A/s) dIF/dt(A/s) 1000 0 10 100 Figure 9. Dynamic parameters versus junction temperature Figure 10. Thermal resistance, junction to ambient, versus copper surface under tab (Epoxy printed circuit board FR4, ecu = 35 m) Rth(j-a) (C/W) 80 DPAK QRR; IRM [T j] / Q RR; IRM [T j=125C] 1.4 1.2 1.0 0.8 0.6 QRR IRM IF=30 A VR= 160 V 70 60 50 40 30 20 10 0.4 0.2 Tj(C) 0.0 25 50 75 100 125 150 SCU(cm) 0 0 5 10 15 20 25 30 35 40 4/10 STTH3002 Ordering information scheme 2 Ordering information scheme STTH 30 02 XXX Ultrafast switching diode Average forward current 30 = 30 A Repetitive peak reverse voltage 02 = 200 V Package W = DO-247 in Tube PI = DOP3I in Tube G = D2PAK in Tube G-TR = D2PAK in Tape and reel 5/10 Package information STTH3002 3 Package information Epoxy meets UL94, V0 Cooling method: by conduction (C) Recommended torque value: 0.8 Nm Maximum torque value: 1.0 Nm Table 5. DO-247 dimensions DIMENSIONS REF. Millimeters Min. A D V Inches Min. 0.191 0.086 0.015 0.039 0.078 Typ. Max. 0.203 0.102 0.031 0.055 Typ. Max. 5.15 2.60 0.80 1.40 4.85 2.20 0.40 1.00 2.00 2.00 10.90 15.45 19.85 3.70 18.50 14.20 34.60 5.50 2.00 5 60 3.55 E V Dia F F2 A H F3 G H 2.40 0.078 0.429 0.094 L5 L L2 L4 F2 L3 F3 V2 F G M E L1 D 15.75 0.608 20.15 0.781 4.30 0.145 0.728 14.80 0.559 1.362 0.216 3.00 0.078 5 60 3.65 0.139 0.620 0.793 0.169 L L1 L2 L3 L4 L5 M V V2 Dia. 0.582 0.118 0.143 6/10 STTH3002 Table 6. DOP3I dimensions Package information DIMENSIONS REF E R E1 OP c A Millimeters Min. Max. 4.60 1.40 1.55 0.70 13.10 15.50 7.75 11.30 21.10 15.60 4.17 2.90 Inches Min. 0.173 0.047 0.057 0.020 0.474 0.594 0.297 0.425 0.815 0.565 0.161 0.106 Max. 0.181 0.055 0.061 0.028 0.516 0.610 0.305 0.445 0.831 0.614 0.164 0.114 A b c c1 4.40 1.20 1.45 0.50 12.15 15.10 7.55 10.80 20.4 14.35 4.08 2.70 G D Y D E E1 L e G b Q e c1 L P Q R Y 4.60 typ. 15.80 16.50 0.181 typ. 0.622 0.650 7/10 Package information Table 7. D2PAK dimensions DIMENSIONS REF. Millimeters Min. A A E L2 C2 STTH3002 Inches Min. 0.173 0.098 0.001 0.027 0.045 0.017 0.048 0.352 0.393 0.192 0.590 0.050 0.055 0.094 Max. 0.181 0.106 0.009 0.037 0.067 0.024 0.054 0.368 0.409 0.208 0.624 0.055 0.069 0.126 Max 4.60 2.69 0.23 0.93 1.70 0.60 1.36 9.35 10.40 5.28 15.85 1.40 1.75 3.20 4.40 2.49 0.03 0.70 1.14 0.45 1.23 8.95 10.00 4.88 15.00 1.27 1.40 2.40 A1 A2 B D B2 C L L3 A1 B2 B G A2 2mm min. FLAT ZONE R C2 C D E G L V2 L2 L3 M R V2 0.40 typ. 0 8 0.016 typ. 0 8 Figure 11. D2PAK footprint (dimensions in mm) 16.90 10.30 1.30 5.08 8.90 3.70 In order to meet environmental requirements, ST offers these devices in ECOPACK(R) packages. These packages have a lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. 8/10 STTH3002 Ordering information 4 Ordering information Part Number STTH3002W STTH3002PI STTH3002G STTH3002G-TR Marking STTH3002 STTH3002 STTH3002 STTH3002 Package DO-247 DOP3I D2PAK D2 PAK Weight 4.4 g 4.46 g 1.48 g 1.48 g Base qty 30 30 50 1000 Delivery mode Tube Tube Tube Tape and reel 5 Revision history Date 03-May-2006 Revision 1 First issue Description of Changes 9/10 STTH3002 Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries ("ST") reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST's terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such third party products or services or any intellectual property contained therein. UNLESS OTHERWISE SET FORTH IN ST'S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS EXPRESSLY APPROVED IN WRITING BY AN AUTHORIZE REPRESENTATIVE OF ST, ST PRODUCTS ARE NOT DESIGNED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS, WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY, DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any liability of ST. ST and the ST logo are trademarks or registered trademarks of ST in various countries. Information in this document supersedes and replaces all information previously supplied. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners. (c) 2006 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America www.st.com 10/10 |
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